Present industry rumors collected

• Performance per core increase will be below 4% and can be even negative
• Core counts per chiplet won't increase and will stay at 8 cores
• Cache size can increase by around 50-75%
• Chip will offer dual channel DDR5 support, AMD still having issues with memory controller
• AMD can restrict usage of external USB controllers and can ask for special license payment for such use
• TSMC have major issues with performance version of 5nm process (now only low power version is offered)
• AMD now has severe thermal issues, test chips can't reach even 3.5Ghz without thermal damage
• CPU prices will jump around 30-50% for same positioned model in lineup
• Chipset prices will jump 20-35%
• Motherboard prices will jump 25-45% due to components inflation and chipset price
• AMD will restrict features for entry level and mid level chipset very similar to Intel offerings
• AMD will turn all marketing to focus on mobile chips (around 80% of marketing expenses)
• AMD will also participate in the anti desktop marketing under green economy taglines (your desktop is major contributor of global warming)

AMD plans to migrate to the AM5 platform, bringing the new DDR5 and USB 4.0 protocols. The current aim of Zen 4 is to be extremely competitive among competing products and to bring many IPC improvements. Just like Zen 3 used many small advances in cache structures, branch prediction, and pipelines, Zen 4 is aiming to achieve a similar thing with its debut. The state of x86 architecture offers little room for improvement, however, when the advancement is done in many places it adds up quite well, as we could see with 19% IPC improvement of Zen 3 over the previous generation Zen 2 core. As the new core will use TSMC's advanced 5 nm process, there is a possibility to have even more cores found inside CCX/CCD complexes. We are expecting to see Zen 4 sometime close to the end of 2021.

Rembrand CPU

• 5nm
• PCIe 5.0
• DDR5 support
• LGA 1718 socket

On TDP

Tom's Hardware was able to get new clarifications from AMD representatives, who nevertheless found out that for the Socket AM5 platform the TDP limit is 170 W, and the PPT value is obtained by multiplying the TDP by 1.35, which ultimately gives 230 W. It is this electrical power that the Socket AM5 processor socket is capable of delivering, and it is precisely this maximum heat dissipation that the Ryzen 7000 processors will be capable of. Robert Hallock subsequently had to admit that TDP is indeed 170 W, and PPT reaches 230 W.

Socket AM4 Ryzen processors have a TDP of no more than 105W, while the PPT value was 142W. In the new platform, the power consumption ceiling has been raised from Socket AM4 to make it easier for older processors with a large number of cores to work in high-load situations.

Integrated Ryzen 7000 graphics will be "standard". It is based on a 6-nm process technology and contains a small number of built-in computing units. Its main tasks are to provide support for video encoding and decoding and the operation of several video outputs. For enthusiasts, "embedding" will help diagnose a discrete video card in the system. The integrated graphics configuration will be the same for all Ryzen 7000 Raphael series processor models.

Hallock also added that the presence of integrated graphics as part of all Ryzen 7000 processors does not mean the company is abandoning hybrid processors (APUs) in the desktop chip environment. In the future, processors for Socket AM5 with a powerful integrated graphics core will also appear on the market. That is, we can expect the release of conditional Ryzen 7000G.

“We do not consider Ryzen 7000 series processors as APUs. Yes, Ryzen 7000 also have integrated graphics, but they are different solutions. For us, APU is a product with powerful integrated graphics that can run games and has all the capabilities to encode and decode video and so on. The Ryzen 7000 "insert" is intended only to display a picture on the screen, offer basic video processing capabilities, launch a home theater, and some work applications. But this graphics is not game level. APUs are an integral part of our roadmap.

Performance gains slides

AMD Ryzen 7000’s CCD manufactured with TSMC N5 node features 6.57 billion transistors, 58% more than Zen3 based on TSMC N7. The CCD codenamed “Durango” is AMD’s next-gen chiplet featuring up to eight Zen4 cores codenamed “Persephone”. New architecture, increased cache and AVX512 instruction support are the main factors for the increased transistors’ density.

AMD Zen4 chiplet has 90 million transistor per square mm, which 40 MTr/mm² more than Zen3. Each of the Zen4 cores has 1MB of L2 cache, twice as big as Zen3’s, while the cache area scaling is smaller. Effectively taking a higher percentage of total die area, but also meaning that logic area has doubled in transistors density, the site reports.

As a consequence, the cooling of the Ryzen 7000 desktop CPU may be more complicated. The 72.5 mm² die with maximum turbo power approaching 170W results in 1.92W per mm², and that’s even without considering the max peak power (PPT) of 230W. For Zen3 CPUs that was 83.74 mm² die with 105W TDP so 1.25 W/mm².

Geekbench scores